Technically these are all System in Package (SiP) rather than systems on a chip (SoCs). It’s not cost effective to waste silicon area on things like memory and storage in the latest and greatest TSMC nodes, so they have several different silicon dies that they connect together using advanced packaging techniques, but where each silicon die in that package might come from a different foundry/process.
Intel cpus are SOCs too.
Soc is almost a meaningless term these days. It used to mean “a mobile CPU”. But for power reasons laptop CPUs have all become SOCs too.
Technically these are all System in Package (SiP) rather than systems on a chip (SoCs). It’s not cost effective to waste silicon area on things like memory and storage in the latest and greatest TSMC nodes, so they have several different silicon dies that they connect together using advanced packaging techniques, but where each silicon die in that package might come from a different foundry/process.